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適用于6，8英寸晶圓

• *小200微米芯片拾取
• 可選配的非表面接觸拾取功能
• Waffle Pak, Gel-Pak® 及 Film Frame 輸出
• 可選配背面，側面檢測
• 可選配芯片轉向功能
• 根據不同產品，產量可達500-1200 UPH
• 10分鐘以內快速更換

拾取大片 GaAs Die

Royec semi-automatic de35-st chip pickup system

Suitable for 6 - ａnd 8-inch wafers

• minimum 200 micron chip pickup

• optional non-surface contact pickup function

• Waffle Pak, gel-pak ® ａnd Film Frame output

• optional back ａnd side inspection

• optional chip steering function

• up to 500-1200 UPH, depending on the product

• quick replacement within 10 minutes

Pick up large pieces of GaAs Die